JPH0245573B2 - - Google Patents

Info

Publication number
JPH0245573B2
JPH0245573B2 JP57233104A JP23310482A JPH0245573B2 JP H0245573 B2 JPH0245573 B2 JP H0245573B2 JP 57233104 A JP57233104 A JP 57233104A JP 23310482 A JP23310482 A JP 23310482A JP H0245573 B2 JPH0245573 B2 JP H0245573B2
Authority
JP
Japan
Prior art keywords
frame
die
brush
press
frame body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57233104A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59123616A (ja
Inventor
Yoshio Tazawa
Sukehito Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEIEI KOSAN KK
Original Assignee
SEIEI KOSAN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEIEI KOSAN KK filed Critical SEIEI KOSAN KK
Priority to JP23310482A priority Critical patent/JPS59123616A/ja
Priority to EP84107011A priority patent/EP0170706B1/en
Publication of JPS59123616A publication Critical patent/JPS59123616A/ja
Publication of JPH0245573B2 publication Critical patent/JPH0245573B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00—De-stacking of articles
    • B65G59/06—De-stacking from the bottom of the stack
    • B65G59/061—De-stacking from the bottom of the stack articles being separated substantially along the axis of the stack
    • B65G59/062—De-stacking from the bottom of the stack articles being separated substantially along the axis of the stack by means of reciprocating or oscillating escapement-like mechanisms
    • B65G59/063—De-stacking from the bottom of the stack articles being separated substantially along the axis of the stack by means of reciprocating or oscillating escapement-like mechanisms comprising lifting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP23310482A 1982-12-28 1982-12-28 ダイクリ−ナ− Granted JPS59123616A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP23310482A JPS59123616A (ja) 1982-12-28 1982-12-28 ダイクリ−ナ−
EP84107011A EP0170706B1 (en) 1982-12-28 1984-06-19 A frame separator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23310482A JPS59123616A (ja) 1982-12-28 1982-12-28 ダイクリ−ナ−

Publications (2)

Publication Number Publication Date
JPS59123616A JPS59123616A (ja) 1984-07-17
JPH0245573B2 true JPH0245573B2 (en]) 1990-10-11

Family

ID=16949832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23310482A Granted JPS59123616A (ja) 1982-12-28 1982-12-28 ダイクリ−ナ−

Country Status (1)

Country Link
JP (1) JPS59123616A (en])

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6162007U (en]) * 1984-09-28 1986-04-26
JPH0763768B2 (ja) * 1989-08-22 1995-07-12 宇部興産株式会社 金型表面のブラッシング装置
JP4935554B2 (ja) * 2007-07-19 2012-05-23 株式会社デンソー 車両用送風装置
JP5592711B2 (ja) * 2010-06-18 2014-09-17 三和システムエンジニアリング株式会社 粉末成形品のばり取り装置
CN106594456B (zh) * 2016-12-16 2018-12-25 天津惠博普管道技术有限公司 一种清管器接收防撞装置
CN108789917A (zh) * 2018-06-19 2018-11-13 惠州市中塑王塑胶制品有限公司 一种塑料颗粒处理设备

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5976207A (ja) * 1982-10-25 1984-05-01 Kazuo Bando プラスチツク成形金型面のクリ−ニング装置

Also Published As

Publication number Publication date
JPS59123616A (ja) 1984-07-17

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